Analog Devices Inc. has partnered with Taiwan Semiconductor Manufacturing Co Ltd (TSMC) to launch the application of TSMC’s 65nm process technology for ADI’s SoftFone baseband processors. The TSMC’s 65nm process technology to ADI’s SoftFone baseband processors allows design to take benefit from lower cost and better power efficiency.
The TSMC’s 65nm process technology supports a standard cell gate density, which is twice of TSMC’s 90nm process. The technology is also featured with 6T-SRAM and 1T embedded DRAM memory cell sizes. Additionally, the technology also offers variety of capabilities, which are given below:
1) Mixed signal and RF functionality to support analog and wireless design
2) Embedded high density memory to support integration of logic and memory
3) Electrical fuse to support customer encryption needs.
According to Kenneth Kin, senior vice president of worldwide sales and service for TSMC, this is the first time that Analog Devices’ baseband product is based on TSMC’s 65nm process. This shows deep and strong collaboration between the two companies starts from the initial design to tape-out to working silicon.
TSMC’s 65nm technology is the company’s third-generation semiconductor process, which employs copper as well as low dielectric constants. The technology is 9-layer metal process with core voltages of 1.0 or 1.2 volts, and I/O voltages of 1.8, 2.5 or 3.3 volts.
Image Credit: Chip Works & Electric design
Via: Tech On
